Electronic Packaging Series

The commonly used metal material for KWT electronic packaging is Kovar alloy. KWT has made a breakthrough in the co-sealing and sintering process of non-magnetic metal materials with glass and ceramics. Now it has successfully used aluminum and copper as the substrate (carrier plate), and the pins are combined by Kovar, copper, aluminum and glass and ceramics. overall. In addition to meeting the requirements of the existing technology, it also has the advantages of 1. Minimal stress at the joint of the chip or substrate, 2. Fast heat dissipation, 3. Light weight, etc. It is a major breakthrough for microelectronic packaging products such as microwave electrical packaging, microelectronic packaging, optoelectronic packaging, waveguide filter, and optical solder communication connectors for power devices. Example: Fast heat dissipation extends the life of the chip, and avoids chip cracking due to excessive temperature caused by slow heat dissipation.

Product performance

(1) Insulation strength ≥10⁴MΩ, 1000Vdc;

(2) Leakage rate: <>^-11Pa m³/s;

(3) Withstand voltage test: 1000Vac Sec 0.5mA;

(4) Tension test: 10kg tension pins are not loose;

(5) The surface is nickel-plated, silver-plated, gold-plated 3～5um;

(6) Salt spray test: 48 hours, there should be no rust spots on the nickel-plated surface.

The specifications, dimensions and performance of the electronic packaging series products are implemented according to customer requirements. The airtight pressure (positive pressure25-35kg, Negative pressure10^-11)

Material 1Substrate composite metal plate: carbon steel,SUS304, Copper, aluminum;

2Pins: Kovar, copper core alloy, copper, aluminum;

Surface treatment: nickel plating, silver plating, gold plating.

The product series are as follows

KWT-001

KWT-002

KWT-003

KWT-004

KWT-005

KWT-006

KWT-007

KWT-008