Metal packageWhat is the current state of the material and how is its development? The editor of Keweite will give you a detailed explanation below.

Metal packaging is a form of electronic packaging in which metal is used as the shell or base, the chip is mounted on the shell or base directly or through a substrate, and the lead passes through the metal shell or base, mostly using glass-metal sealing technology. It is widely used in the packaging of hybrid circuits, mainly military and customized special hermetic packaging. It has been widely used in many fields, especially in the military and aerospace fields.

It has various forms, flexible processing, and can be combined with certain parts(Hybrid integratedA/DorD/Aconverter)Fusion into one, suitable for lowI/ONumerous single-chip and multi-chip applications are also suitable for radio frequency, microwave, photoelectric, surface acoustic wave and high-power devices, which can meet the requirements of small batches and high reliability. In addition, in order to solve the heat dissipation problem of the package, most types of packages also use metals as heat sinks and heat sinks. This article mainly introduces the metal materials used and under development in metal packaging. These materials include not only metal packaging shells or bases, metal materials used for leads, but also metals that can be used for various packaging substrates, heat sinks and heat sinks. material.

1Traditional metal packaging materials and their limitations Chip materials such asSi,GaAsAnd ceramic substrate materials such asA12O3,BeO,AINThermal expansion coefficient(CTE)Between3×10-6-7×10-6K-1between. In order to realize the protection of chip support, electrical connection, heat dissipation, machinery and environment, metal packaging materials should meet the following requirements:

①Low thermal expansion coefficient matched with chip or ceramic substrate,Reduce or avoid the generation of thermal stress;

②Very good thermal conductivity, providing heat dissipation;

③Very good conductivity, reducing transmission delay;

④GoodEMI/RFIShielding ability

⑤Low density, sufficient strength and hardness, good processing or forming performance;

⑥Platability, solderability and corrosion resistance to achieve reliable combination with chips, cover plates and printed boards, sealing and environmental protection;

⑦Lower cost.

Traditional metal packaging materials includeAl,Cu,Mo,W, Steel, Kovar alloy andCu/WwithCu/MoWait.

I believe that through the above explanations, everyone has a deeper understanding of the current situation and development of metal packaging materials. If you are interested in this, you can directly communicate with Kevit’s online customer service. Welcome customers to come to consult and purchase!

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