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Glass packaging technology (below)

Mismatch sealing: There are two types of mismatch sealing (1) Co-sealing and sintering process engineering between non-magnetic metal jacket base and glass, ceramic and magnetic metal electrical conductor poles and pins. Usually stainless steel, copper, aluminum are used as the outer jacket substrate, the electrical conductor poles, and the pins are made of iron-nickel alloy, stainless iron and glass through a co-sealing sintering process. The expansion coefficient of the base metal of the jacket> the expansion coefficient of the glass> the expansion coefficient of the electric conductor pole and the pin. When the thermal expansion rate of the base metal of the jacket is higher than that of the glass, a compression seal is produced. During the sintering and packaging process, the jacket matrix shrinks around the glass during solidification, and a good uniform radial compression stress is generated at the metal interface of the glass and the jacket matrix, which can withstand thermal and mechanical stress. The interface bonding strength of the electrical conductor pole, pin and glass comes from the radial compression stress and the thin and thick oxide layer of the electrical conductor pole and pin to ensure a good sealing effect.

(2) For the sealing of non-magnetic metal, the outer jacket substrate and electric conductor poles and pins are non-magnetic metal, glass and ceramics and are sealed by co-sealing sintering process.

Non-magnetic metal sealing products are more and more widely used in the market. Because magnetic metal sealing connectors have magnetic interference and magnetic field gravitation interference in the communication signal, the influence of dielectric and the poor heat dissipation effect often lead to unsmooth signals. . For equipment and electrical connector packaging products with large power output and input, the electrical conductor pole and the jacket base will produce the jacket base magnetism and eddy current under the condition of large current output and input. The product heats up rapidly, and the heat dissipation of the outer jacket substrate is slow, causing the connectors and equipment to burn. To meet the performance requirements of the product, the adjustment of various parameters during the sintering and packaging process is particularly complicated and involves a wide range of areas. Wetting, oxidizing (metal, glass) bonding, ceramic and glass crystallite changes, adjustment of the atmosphere composition ratio, material expansion coefficient, metal material processing, mechanical toughness and internal stress changes during the sintering process of non-magnetic metals, Glass and ceramic sealing is extremely important.

The glass, ceramic and metal packaging process itself is a complex physical and chemical reaction process, involving thermal engineering, gas flow, the composition ratio of the mixed gas, the toughness and stress changes of the metal material during the sealing process, and it must be based on the entire sealing process. The combination of glass, ceramic and metal changes to determine the co-sealing sintering process parameters, the aerobic composition of glass and metal, the change of metal material and the change of glass liquid wetness, the change of ceramic and glass affinity and the bond change, recrystallization and cooling of glass All phase separation phenomena must be fully and comprehensively considered.

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