Metal packageWhat are the characteristics of Cu-based materials? The editor of Keweite will give you a detailed explanation below.

CuMatrix composite

Pure copper has a lower annealing point, and the softening of the base made of it can cause chip and/or substrate cracking. In order to increase the annealing point of copper, a small amount can be added to copperAl2O3, Zirconium, silver, silicon. These substances can make the annealing point of oxygen-free high-conductivity copper from320℃ increased to400℃, while thermal conductivity and electrical conductivity are not lost. Both at home and abroadAl2O3Dispersion strengthened oxygen-free high-conductivity copper products, such as the United StatesSCMMetal Products CompanyGlidcopcontain99.7% Copper and0.3% DispersionAl2O3. JoinAl2O3After that, the thermal conductivity is slightly reduced to365W(m-1K-1), The resistivity increases slightly, for1.85μΩ·cm, But the yield strength has been significantly increased. This material has been widely used in metal packaging, such as the United StatesSinclairThe company uses in the metal packaging of power devicesGlidcopInstead of oxygen-free high-conductivity copper as the base. United StatesSencitronCompany inTO-254Ceramic insulators andGlidcopLead sealing. inGlidcopbasically,SCMThe company also combines it with other low-expansion materials such as Kovar,Fe-42Ni,WorMoFurther combine to formCTELow, high-strength composite material that maintains high electrical conductivity. Such asGlidcopversus50% Kovar’s composite yield strength is760MPa,CTEfor10×10-6K-1,Conductivity30%IACS.Glidcopversus25%MoThe yield strength of the composite material is690MPa,CTEfor12×10-6K-1, The conductivity is70%IACS.

20century90Years, AmericaTexasInstrumentsThe company developed aCuvarControllable expansion, high thermal conductivity composite material, it is inCuAdd low expansion alloyInvar,

But the thermal conductivity is very low, as11W(m-1K-1)Powder fromCuThe matrix provides thermal and electrical conductivity,InvarLimit thermal expansion.CuvarThe workability is very good, easy to plateCu,Ni,Au,Ag, Is the traditional low expansion alloy Kovar and42alloy(Fe-42Ni, Chinese brand4J42)Alternatives to traditionalW,MoBase heat management materials. butCuvarThe material is greatly affected by trace impurities,InvarwithCuThe mutual diffusion during the sintering process has a certain influence on the electrical conductivity, thermal conductivity and thermal expansion properties of the composite material.

I believe that through the above explanation, everyone isBase composite materials have a deeper understanding. If you are interested in metal packaging, you can directly communicate with Kevit’s online customer service. Customers are welcome to consult and purchase!

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