On the basis of Cu-based conforming materials,Metal packageHow much can be optimized? The editor of Keweite will give you a detailed explanation below.

By putting highCTEofCuHigh pressure rolling to lowCTEOn the metal or alloy base material, and then annealed to form a solid solution connection, a sandwich structure can be prepared.CuMaterial, this is aCTEAdjustable laminated composite material with variable thermal conductivity. The two main claddings used in packagingCuMaterial isCu/Invar/Cu(CIC)withCu/Mo/Cu(CMC).

CICinZDirectional thermal conductivity is lower, which is comparable to sandwichInvarLow thermal conductivity is related.CICHas good plasticity, blanking andEMI/RFIShielding, in addition to being used for printed boards, it can also be used for solid-state relay packaging, power module packaging, and hermetically sealed bases.CMCPunching, non-magnetic, strong interface bonding, can withstand repeated850℃ thermal shock. Because of itsCTEAdjustable, so it can be reliably welded with Kovar alloy side walls.CMCComposite materials have been used to make microwave/RF housings, microwave housings, power transistors,MCMThe base, optical fiber housing, photoelectric component substrate, laser diode, cover plate, heat sink and heat sink, etc.

inCu/Mobasically,PoleseThe company developedCu/Mo-Cu/CuMaterials to meet the controllableCTE, High thermal conductivity and high electrical conductivity needs.2003year7The first thickness ratio of the month is1-4—1ofCu/Mo-Cu/CuListed, its25-400cCThe thermal conductivity of300W(m-1K-1),CTEfor7.0×10-6-8.5×10-6K-1, The density is9.45gcm-3. Can be used for microwave carrier and heat sink, microelectronic package base,GaAsDevice installation andSMPconductor.

In addition, AmericanPolymetallurgicalwithAnometOther companies have also produced copper core leads for glass and metal sealing. The outside of the copper core can be52alloy(Fe-50Ni, Chinese brand4J50)Kovar(Fe-29Ni-17Co),42-6alloy(Fe-42Ni-6CrAnd other expansion materials. The two are completely metallurgically combined, with good mechanical strength, toughness and air tightness, which not only provides the high electrical conductivity of copper, but also provides the ability to seal the expansion material and glass. The radius of the copper core and the low expansion alloy can be any ratio, the standard ratio is2:1with3:1. At the ratio3:1When the conductivity of the copper core lead is14%IACS, That is, the resistivity12μΩ·cm.

Through the above explanation, I believe that everyone has a deeper understanding of Cu-based conforming materials, if everyone is interested in metal packaging. You can directly communicate with Keweite online customer service. Welcome customers to come to consult and purchase!