Metal packageWhat is the structure of the Cu-based composite material? What's the hidden problem. The editor of Keweite will give you a detailed explanation below.

The Cu-based composite material can also use C fiber, B fiber, SiC particles, AlN particles and other materials as reinforcements. For example, carbon fiber (which can be converted into graphite fiber by high temperature treatment) has a CTE of -1×10-6-2×10-6K-1, which has a high elastic modulus and axial thermal conductivity. P120 and P130 carbon fibers have axial The thermal conductivity is 640W (m-1K-1) and 1100W (m-1K-1), and the thermal conductivity of carbon fiber produced by the CVD method is as high as 2000W (m-1K-1). Therefore, copper-based composite materials reinforced with carbon fiber (graphite fiber) are very attractive in high power density applications. The material compounded with copper has a CTE of -0.5×10-6K-1 along the length of the carbon fiber, and a thermal conductivity of 600-750W (m-1K-1), while the CTE perpendicular to the length of the carbon fiber is 8×10-6K -1, the thermal conductivity is 51-59W (m-1K-1), which is at least one order of magnitude lower than the thermal conductivity along the length of the fiber. Therefore, when used as a package base or heat sink, this composite material is not very effective in bringing heat to the next level, but it is extremely effective in terms of heat dissipation. This is related to the anisotropy of the fiber itself, fiber orientation and fiber volume fraction will affect the performance of the composite material [3]. This problem can be solved by adopting methods such as fiber network arrangement, spiral arrangement, oblique network arrangement, or using discontinuous carbon fibers (randomly oriented fibers with a length of about 10 μm) as a reinforcement.

The copper-diamond composite material is called Dymalloy. This composite material has good thermophysical and mechanical properties. Tests have shown that when the volume fraction of diamond is about 55%, the thermal conductivity at 25-200℃ is about 600W (m-1K-1), which is better than copper. It must be high, and its CTE is 5.48×10-6-6. 5×10-6K-1, which can match the CTE of Si and GaAs. This material has been used by Lawrence Livermore National Laboratory and Sun Microsystems in the United States as a substrate for multi-chip modules (MCM). In June 2002, Somitomo Electric Industries (SEl) also developed a copper-diamond composite material, named Diamond-Metal-Composite for Heat Sink (DMCH).

I believe that through the above explanation, everyone has a deeper understanding of the structure of Cu-based composite materials. If you are interested in metal packaging, you can directly communicate with Keweite’s online customer service. Customers are welcome to consult and purchase!