Glass-to-metal encapsulation technology combines metal and glass to form vacuum-encapsulated electrical connectors, packages, feedthroughs, or optical windows\/lenses in electronic components. Glass-to-metal hermetic encapsulation can meet the stringent requirements of harsh environments and high performance, with unparalleled reliability.

Glass encapsulates electrical or light conductors, forming an anti-penetration barrier. As an inorganic material, glass encapsulation does not age, making it useful when reliable protection or long-term protection of sensitive electronic components is required.

As an encapsulation material, glass forms an airtight barrier against moisture intrusion, condensation and leakage, providing more reliable protection in harsh environments compared to non-airtight polymer encapsulations. Glass and metal can be directly encapsulated together without the need for additional interface materials, reducing process complexity compared to ceramic-metal encapsulation alternatives.

Glass-metal packaging can transmit electrical or optical signals into vacuum packaging shells or related components, which is a key function of this technology. At the same time, inorganic glass packaging can prevent water vapor intrusion or packaging leakage, preventing damage or malfunction of electrical components\/systems, semiconductors, plating chemicals, ignition primers or other substances inside the packaging.

Glass-to-metal packages are engineered to operate reliably under harsh operating conditions such as extreme temperatures, humidity, pressure, or chemicals. They also meet requirements for longevity, increased performance and efficiency, and innovative designs. The core purpose of glass-to-metal packages is to enable reliable connections that provide protection for the manufacture of high-quality and long-lasting packaged components or devices. The key characteristic of glass-to-metal package technology is its versatility.

It has a wide range of application scenarios, including high-temperature sensors, oil and gas applications, batteries and capacitors, nuclear reactors, implantable medical devices, optoelectronic packaging, automotive airbags and many other products and industry applications.