Semiconductor packaging refers to the process of processing the tested wafer according to the product model and functional requirements to obtain independent chips. The packaging process is: cutting the wafer from the previous wafer process into small wafers (Die) after the dicing process, and then sticking the cut wafers to the island frame corresponding to the substrate (lead frame), and then using ultra-fine metal (gold, tin, Copper, aluminum) wires or conductive resin connect the pads of the chip to the corresponding pins (Leads) of the substrate to form the required circuit; then the independent chip is packaged and protected with a plastic shell. After plastic sealing, a series of operations are required. After the packaging is completed, the finished product is tested, usually through warehousing, testing, packaging and other processes, and finally warehousing and shipping.

The three major semiconductor packages are classified according to the materials used. There are metal packages, ceramic packages, metal-ceramic packages and plastic packages.

Category 1: Semiconductor metal packaging

Metal packaging started with triode packaging, and then slowly applied to in-line flat packaging, which is basically a metal glass assembly process. Due to the strict size of metal parts, high precision, and easy mass production, this kind of packaging is cheap, has excellent performance, and the packaging process is simple and flexible. It is widely used in transistors and hybrid integrated circuits, such as oscillators, amplifiers, frequency discriminators, AC and DC in converters, filters, and relays. In electrical appliances and other products, many micro packages and multi-chip modules (MCM) also use this metal package now and in the future. Metal package types include optoelectronic device packages, including window type, lens type and fiber optic type; sub-envelope device packaging includes type A, B type and C type; hybrid circuit packaging includes dual in-line type and flat type; special device packaging includes rectangular positive type, multi-layer multi-window type and non-magnetic material type.

Category 2: Semiconductor ceramic packaging

Most of the early semiconductor packages were ceramic packages. With the development of highly integrated and high-speed semiconductor devices, the miniaturization and price reduction of electronic equipment, ceramic packages were partially replaced by plastic packages, but ceramic packages have many uses and still have irreplaceable functions, especially the increase in operating frequency of integrated circuits. Components, signal transmission speeds are accelerating and chip power consumption is increasing. It is necessary to choose low resistivity wiring conductor materials, low dielectric constant, high conductivity insulating materials, etc. Ceramic packaging types include DIP and SIP; large-scale integrated circuit packaging includes PGA, PLCC, QFP and BGA.

Category 3: Semiconductor plastic packaging

Plastic packaging has strong vitality because of its low cost, simple process and suitable for mass production. Since its birth, it has developed faster and faster, and its share in packaging is also growing. Currently, plastic packaging accounts for more than 95% of the global integrated circuit market. In a world where consumer circuits and equipment are basically plastic packaging; industrial circuits also account for a large proportion and have the most types of packaging. Types of plastic packaging include discrete device packaging, including A and F types; integrated circuit packaging includes SOP, DIP, QFP and BGA.

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